This graduate-level course explores the fundamental principles and advanced applications of transport phenomena in chemical engineering, emphasizing momentum, heat, and mass transfer from both microscopic (molecular) and macroscopic (continuum) perspectives. Students will develop analytical skills to model complex systems, incorporating dimensional analysis, scaling techniques, and specialized topics like moving boundary problems, boundary layer theory, and microfluidic transport. The course aims to equip students with the tools to solve real-world engineering problems in fields such as process design, biotechnology, and materials science. Transport phenomena—encompassing momentum (fluid flow), heat, and mass transfer—play a critical role in semiconductor manufacturing processes. These principles govern the behavior of materials during fabrication steps like deposition, etching, doping, and thermal annealing. In semiconductor processing, precise control of transport processes ensures device performance, yield, and scalability. For instance, computational simulations of transport in plasma-based chemical vapor deposition (CVD) highlight how fluid dynamics and mass transfer influence film uniformity. This report outlines key applications, drawing from microscopic (e.g., diffusion at atomic scales) and macroscopic (e.g., reactor-scale flows) viewpoints.

R. B. Bird, et. al., Transport Phenomena, John Wiley and
Sons.
J. R. Welty, et. al., Fundamentals of Momentum, Heat, and Mass Transfer, John Wiley and Sons.

William m. Deen, Analysis of Transport Phenomena, Oxford University Press