本課程已於 2026-09-29停開
名額
15
已選
0
餘額
15
上課時間
三/2,3,4[HT109]
修課班級
半導體碩1 · 1年級以上
課程資訊
請至半導體學程系辦進行人工加選。
選課分析
This course aims to provide students with an understanding of the evolution of electronic packaging technologies, covering various package structures and their applications, including flip-chip packaging, wafer-level packaging (WLP), three-dimensional integrated packaging (3D packaging), and fan-out packaging technologies and structures.
Lau, John H., Semiconductor Advanced Packaging, Springer, 2021.
查詢過去本課程開課紀錄：
Semiconductor Packaging 歷史開課紀錄